Semiconductor integrated circuit device, memory module, storage device

ABSTRACT

To improve the efficiency for repairing a defect of a large-scale integrated circuit. 
     A semiconductor integrated circuit device comprises, a central processing unit ( 10 ), an electrically reprogrammable nonvolatile memory ( 11 ) and a volatile memory ( 12, 13 ) while sharing a dat bus ( 16 ), and utilizes the stored information of the nonvolatile memory so as to repair a defect of the volatile memory. This volatile memory includes volatile storage circuit ( 12 AR,  13 AR) for latching the repair information for repairing a defective normal memory cell with a redundancy memory cell. The nonvolatile memory reads out the repair information from itself in response to an instruction to initialize the semiconductor integrated circuit device. In response to the initializing instruction, the volatile storage circuit latches the repair information from the nonvolatile memory. Any fuse program circuit is not needed for the detect repair, but a defect to occur after a burn-in can be newly repaired so that the new defect can be repaired even after the packaging over a circuit substrate.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation application of application Ser. No.09/756,233, filed Jan. 9, 2001, now a U.S. Pat. No. 6,324,103 which is aDivisional application of application Ser. No. 09/497,119, filed Feb. 3,2000, now a U.S. Pat. No. 6,341,090, which is a Divisional applicationof application Ser. No. 09/435,035, filed Nov. 5, 1999, now a U.S. Pat.No. 6,201,733, the entire disclosures of which are hereby incorporatedby reference.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor integrated circuitdevice in which a volatile memory, such as a DRAM (Dynamic Random AccessMemory) or a SRAM (Static Random Access Memory), and an electricallyrewritable or reprogrammable nonvolatile memory, such as a flash memory,are packaged together with a control processing unit, such as a centralprocessing unit, over a semiconductor substrate; and, more particularly,the invention relates to a repair technique which is effective whenapplied to an on-chip type large-scale integrated circuit, such as aDRAM-consolidated LSI (Large-Scale Integration), a DRAM-embedded LSI ora system LSI.

Nowadays, the large scale of a semiconductor integrated circuit deviceis in the category of a system on-chip, such as a DRAM-consolidated LSI,a DRAM-embedded LSI or a system LSI.

As a semiconductor integrated circuit device is provided with a largerscale, its internal defects can be less ignored. Especially, a memory,such as a DRAM, a SRAM or a flash memory, is expected to have arelatively small area, but a large storage capacity, so that it becomessusceptible to defects caused by the remarkably fine working duringmanufacture and the resultant miniaturization of signals. Therefore, theapplication of a redundancy circuit technique to such semiconductorcircuit devices is important so that an expected system operation can beachieved irrespective of the occurrence of more or less defects.

For enlarging the scale of a semiconductor integrated circuit device, itis frequently desirable to apply a trimming technique for achieving thedesired circuit characteristics. By this trimming technique, an analogamount, such as an internal voltage or current, and a quasi-analogamount, such as the timing of a timing signal, can be sufficientlybrought to a desired value irrespective of the manufacturing dispersionof the semiconductor integrated circuit device.

The redundancy circuit technique and the trimming technique for alarge-scale semiconductor integrated circuit device are well-known. Onesuch technique is disclosed in Japanese Patent Laid-Open No.334999/1995, and in corresponding U.S. Pat. No. 5,561,627, of Hitachi,Ltd., and is used in a program for providing defect repair informationusing the memory cells of an electrically reprogrammable nonvolatilememory, such as a flash memory. In this technique, repair informationspecifying a defective memory cell in the nonvolatile memory is storedin the memory cell of the nonvolatile memory; the repair information islatched in an internal latch circuit at the time of initialization, andthe latched repair information and an access address are compared sothat the access is replaced, in the case of coincidence, by the accessto a redundant memory cell.

On the other hand, another technique is disclosed in Japanese PatentLaid-Open No. 214496/1998, and in corresponding U.S. patent applicationSer. No. 09/016300, of Hitachi, Ltd., and in which trimming informationis stored for use in the storage region of a portion of a nonvolatilememory, such as a flash memory. In accordance with this technique, morespecifically, there is provided a trimming circuit for finely adjustingthe output clamp voltage of voltage clamp means for providing anoperating power source for the flash memory so that the trimminginformation for determining the state of the timing circuit isprogrammed in the memory cells of the flash memory. The programmedtrimming information is read out in a reset operation from the flashmemory and is internally transferred to a register. The state of thetrimming circuit is determined by using the transferred trimminginformation. As a result, the clamp voltage to be outputted from voltageclamp means is trimmed to a value suitable for the operation of theflash memory, thereby compensating for the manufacturing dispersion ofthe semiconductor integrated circuit device.

An example of a system LSI is described on pp. 34 to 38 of “ElectronicMaterials” (issued in January, 1998, by Kabushiki Gaisha KogyoChosakai), wherein, as seen in FIG. 4 thereof, a volatile memory, suchas a flash memory, and a DRAM are consolidated together with a CPU(Central Processing Unit). The technique for forming the nonvolatilememory and the DRAM by a common process is already described in U.S.Pat. No. 5,057,448. On the other hand, examples of a semiconductorintegrated circuit device packaging a flash memory and a DRAM togetherwith a CPU on one semiconductor substrate are described in JapanesePatent Laid-Open Nos. 52293/1989 and 124381/1998.

SUMMARY OF THE INVENTION

Our preceding patent application has proposed the use of storageelements of one flash memory for repairing a defect or to effecttrimming within a closed range of the flash memory. In view of thelarge-scale integration represented by a system on-chip, we haveinvestigated the efficient use of a nonvolatile memory, or one circuitmodule packaged in the large-scale integrated circuit device in relationto another circuit module. In the course of this investigation, we haveconsidered the utilization of the stored information of the nonvolatilememory to repair a defect of a volatile memory, other than thenonvolatile memory itself we have recognized the following new problemsin the investigation of such repair of a volatile memory.

In order to provide the nonvolatile memory with the required repairinformation, more specifically, a procedure is needed to reflect therepair information on the volatile memory. This reflection of theinformation desirably should be realized at a high speed, even if theamount of repair information increases, to cope with an increase in thedefects in accordance with the construction of the volatile memory orthe provision of a large storage capacity.

In studies subsequent to that investigation, Japanese Patent Laid-OpenNo. 131897/1994 has been found, in which it is proposed to use aprogrammable ROM for repairing a defect in the cache memory. However,the programmable ROM in this case is a dedicated circuit elementbelonging to a redundancy memory control circuit in the cache memory,but represents no more than a repairing technique in the closed range ofthe cache memory, and has failed to adequately address ouraforementioned problems, even if it is resultantly compared.

An object of the present invention is to provide a semiconductorintegrated circuit device which is capable of improving the changingefficiency of a coupling change, such as a defect repair, in a circuithaving a large scale logic construction, in which a nonvolatile memorymade accessible by a control processing device and a volatile memory arepackaged.

Moreover, an object of the present invention is to realize a cost byimproving the yield of a semiconductor integrated circuit device whichhas been strictly demanded to have a lower cost because of itslarge-scale logic.

Another object of the present invention is to improve the usability of amemory module by consolidating the specifications of the defect repairof the memory module in a semiconductor integrated circuit device havinga volatile memory, such as a DRAM or a SRAM, as the memory module.

Still another object of the present invention is to provide a datastorage device in which there is stored design data to be used fordesigning a semiconductor integrated circuit device by using a computer.

The foregoing and other objects and novel features of the invention willbecome more apparent from the following description when taken withreference to the accompanying drawings.

Representative aspects of the invention to be described herein will bebriefly summarized in the following.

A first semiconductor integrated circuit device (1A, 1C) according tothe invention comprises, over one semiconductor substrate: anelectrically reprogrammable nonvolatile memory (11) capable of beingaccessed by a control processing device (10), such as a centralprocessing unit, and a volatile memory (12, 13) capable of beingaccessed by the control processing device, so that the storedinformation of the nonvolatile memory may be utilized for a connectionchange to effect a defect repair of the volatile memory. Specifically,the volatile memory includes: a plurality of first volatile memorycells, such as normal volatile memory cells, and a plurality of secondvolatile memory cells, such as redundancy volatile memory cells; and avolatile storage circuit (12AR, 13AR) for holding coupling controlinformation for enabling the first volatile memory cells to be replacedby the second volatile memory cells. The nonvolatile memory includes aplurality of nonvolatile memory cells, some of which are used forstoring coupling control information, so that the coupling controlinformation is read out from the nonvolatile memory cells and outputtedby the reading and setting operations of the coupling controlinformation, such as an instruction to initialize the semiconductorintegrated circuit device. The volatile storage circuit is caused tofetch and store the coupling control information from the nonvolatilememory by the reading and setting operations.

A second semiconductor integrated circuit device (1B) according to theinvention additionally utilizes the stored information of a nonvolatilememory for repairing a defect of the nonvolatile memory. Specifically,the volatile memory includes: a plurality of normal volatile memorycells and a plurality of redundancy volatile memory cells; and avolatile storage circuit (12AR, 13AR) for holding the repair informationfor repairing a defective normal volatile memory cell by replacing itwith one of the redundancy volatile memory cells. The non-volatilememory includes: a plurality of normal nonvolatile memory cells and aplurality of redundancy nonvolatile memory cells; and a volatile storagecircuit (11AR) for holding the repair information for repairing adefective normal nonvolatile memory cell by replacing it with one of theredundancy nonvolatile memory cells. Some of the nonvolatile memorycells are memory cells for storing the information needed for repair ofthe volatile memory and the information needed for repair of thenonvolatile memory. The repair information, as stored in somenonvolatile memory cells, is read out from the nonvolatile memory cellsby executing reading and setting operations, such as an operation toinitialize the semiconductor integrated circuit device, and is fed toand held in the volatile storage circuit in the volatile memory and thevolatile storage circuit in the nonvolatile memory.

According to the first and second semiconductor integrated circuitdevices, the information for coupling control, such as defect repair, isprogrammed in the nonvolatile memory in place of elements, such as thefuse elements, so that the fuse program circuit, the might otherwise beneeded for using the fuse elements, can be eliminated. Accordingly, theuse or step in the manufacture of an apparatus, which is liable to havea relatively high price, such as a laser cutting apparatus for cutting afuse, can be eliminated to lower the cost of manufacture. When the fuseelements are provided, they need to be positioned at a relatively highlayer portion over the semiconductor substrate so that they can be cuteven in the presence of a layer which makes the fuse cutting difficult,such as an aluminum wiring layer to be used for wiring the semiconductorintegrated circuit device or a copper wiring provided to make the signalpropagation delay time shorter. For this structural reason and foravoiding thermal damage to an insulating film or surface protecting filmcovering the semiconductor substrate surface by a laser beam used to cutthe fuse, an opening for the laser exposure has to be formed in theinsulating film or the surface protecting film over the fuse elements.Because such a complicated manufacturing process is required, thesemiconductor integrated circuit device itself has a high price. Inaddition, when the fuse elements are provided, their size reduction isrestricted by the need to provide openings for the laser exposure, sothat the semiconductor substrate takes on a relatively large size. Ifthe fuse program circuit is not used, the manufacturing process issimplified. When a nonvolatile memory is utilized for storing thecoupling control information, it is possible to enjoy an advantage inthe information can be reprogrammed at an arbitrary time and severaltimes. This makes it possible to sufficiently cope with the couplingchange for a defect which occurs at a relatively later step in themanufacturing process, such as the burn-in step in the manufacture ofthe semiconductor integrated circuit device, or a coupling change for adefect which occurs after the packaging over the system or the circuitsubstrate has aged. As a result, a circuit having a large-scale logicconstruction, in which a volatile memory is packaged together with anonvolatile memory, can be sufficiently utilized because it can bechanged after manufacture. Therefore, a cost reduction can be realizedby improving the yield of the semiconductor integrated circuit devicehaving large-scale logic.

The data input terminals of the individual volatile storage circuits(11AR, 12AR, 13AR) are coupled to a data bus (16) with which theindividual data input/output terminals of the nonvolatile memory and thevolatile memory are commonly connected, so that the coupling controlinformation outputted from the nonvolatile memory can be transmittedthrough the data bus to the corresponding volatile storage circuit bythe operations to read out and set the coupling control information,such as the initialization produced by the control processing device,such as the central processing unit. As a result, the general-purposeutility of the nonvolatile memory can be warranted with respect toaccess to the nonvolatile memory by the control processing device.

If there is adopted a construction in which the volatile storage circuitin the volatile memory is connected with the data bus, no considerationneed be given to the addition of special wiring lines for transmittingthe coupling control information, such as the repair information, evenwhen the number of volatile memories is increased.

If the bit number of the entire coupling control information is lessthan that of the data bus, the coupling control information may beprogrammed in parallel in all the volatile storage circuits byconnecting the signals lines of the data bus separately with the datainput terminals of the individual volatile storage circuits.

When the scale of the semiconductor integrated circuit device is large,the frequency of coupling changes against defects is accordinglyincreased to raise the probability of increasing the coupling controlinformation. When the data bus width, i.e., the bit number of the databus is small for the increased coupling control information, theindividual volatile storage circuits can be programmed in series withthe coupling control information. In this case, when the couplingcontrol information is consecutively read out in a plurality of dividedcycles from the nonvolatile memory cells and outputted to the data busin response to a setting operation instruction, such as an instructionto initialize the semiconductor integrated circuit device, the couplingcontrol information to be fed for each reading cycle through the databus may be consecutively fetched and held for each of the reading cyclesby the volatile storage circuit.

Especially in view of the large-scale integration represented by thesystem on-chip, the following items will become apparent. Morespecifically, in order that the nonvolatile memory, or one circuitmodule or memory module packaged on the large-scale integrated circuitdevice, may be efficiently utilized in relation to another circuitmodule or memory module, the stored information of the nonvolatilememory is utilized for coupling control, such as a defect repair of avolatile memory other than the nonvolatile memory. In this case, themeans for effecting transfer of the coupling control information throughthe data bus and the series internal transfer of the plurality of cyclesof the coupling control information is excellent in that, when theinformation or an objective of the coupling control, such as a defect,increases with an increase in the capacity of the volatile memory, theprocess to reflect the control information on the individual volatilememories in accordance with an increase in the amount of controlinformation can be realized at a high speed.

In order to program the volatile storage circuit with the couplingcontrol information using a simple construction, the volatile storagecircuit may hold the coupling control information outputted from thenonvolatile memory, in response to a first state indicating the resetperiod of a reset signal (RESET) instructing the initialization of thesemiconductor integrated circuit device, and the control processingdevice may start a reset exceptional operation in response to the changeof the reset signal from the first state to a second state indicatingthe release or end of reset. In this case, the reset signal has to bekept in the first state for the period necessary for programming thecoupling control information. In other words, the reset release timingby the reset signal should not be premature.

In order to provide a sufficient time for programming of the couplingcontrol information without any substantial restriction on the resetrelease timing of the reset signal, there can be provided a clockcontrol circuit (19, 20) which is initialized in response to the firststate (or reset period) of the reset signal (RESET) instructing theinitialization of the semiconductor integrated circuit device. Inresponse to the change of the reset signal from the first state to thesecond state, the clock control circuit causes the volatile storagecircuit to fetch and hold the coupling control information from thenonvolatile memory, and then the central processing unit is allowed tostart the reset exceptional operation.

Since the nonvolatile memory is reprogrammable, the coupling controlinformation programmed in advance may accordingly be erroneouslyprogrammed. In order to exclude this disadvantage as much as possible,it is advisable to allow the nonvolatile memory to be set by a mode bit(MB2) to an operation mode to allow the reprogramming of the nonvolatilememory cells for storing the repair information and to an operation modeto inhibit the reprogramming.

On the other hand, it is also possible to set by a mode bit (MB1) anoperation mode to allow the reprogramming of the nonvolatile memorycells by a write device connected to the outside of the semiconductorintegrated circuit device, and an operation mode to allow thereprogramming of the nonvolatile memory cells in accordance with theexecution of an instruction by the central processing unit. Then, thecoupling control information can be programmed either on a packagedboard (or on-board) or by the write device. In order to easily realizethe coupling change corresponding to a defect which will occur after thepackaging of the semiconductor integrated circuit device, it is desiredto support the on-board programming mode.

In order to update the coupling control information, such as a demandfor repairing a defect due to the on-board programming, the nonvolatilememory may store a diagnostic program. The diagnostic program causes thecentral processing unit to execute operations to detect a defect againstthe nonvolatile memory and the volatile memory and to program the repairinformation storing nonvolatile memory cells of the nonvolatile memorywith the repair information for repairing a newly defective memory cell.

A third semiconductor integrated circuit device (30) according to thepresent invention extends the information, as stored for use in thenonvolatile memory (11), to one other than the information used for therepair of a defect. Specifically, the semiconductor integrated circuitdevice (30) comprises, over one semiconductor substrate, while sharing adata bus (16): a control processing device, such as a central processingunit (10); an electrically reprogrammable nonvolatile memory (11) whichis able to be accessed by the control processing device; and a volatilememory (12, 13) which is able to be accessed by the control processingdevice. The nonvolatile memory and the volatile memory individuallyinclude register means (11AR, 12AR, 13AR, AR, 31DR, 12DR, 13DR) havingdata input terminals connected with the data bus, so that theirindividual functions are partially determined according to the functioncontrol information set by the individually corresponding registermeans. The nonvolatile memory includes a plurality of nonvolatile memorycells, some of which are used for storing initialization data containingthe function control information. On the other hand, the nonvolatilememory has an operation mode to allow the reprogramming of thenonvolatile memory cells for storing initialization data and anoperation mode to inhibit the reprogramming, so that the initializationdata are read out from the nonvolatile memory cells and outputted inresponse to an instruction to initialize the semiconductor integratedcircuit device. In response to the instruction to initialize thesemiconductor integrated circuit device, the register means fetches andholds the initialization data from the nonvolatile memory.

In this third semiconductor integrated circuit device, in order to loadeach register means reliably with a large amount of initialization datain response to a reset instruction, there may be provided a clockcontrol circuit which is initialized in response to the first state ofthe reset signal for instructing the initialization of the semiconductorintegrated circuit device. In response to the state change of the resetsignal from the first state to the second state, for example, this clockcontrol circuit outputs a first timing signal having a plurality ofphases shifted in activation timing from one another, and then outputs asecond timing signal for causing the control processing device to startthe reset exceptional operation. In response to the activation timing ofthe first timing signal having a plurality of phases, the nonvolatilememory reads the initialization data consecutively in a plurality ofdivided cycles from the nonvolatile memory cells and outputs them to thedata bus. The register means performs an input setting operation tofetch and hold the data of the data bus consecutively for all readingcycles of the initialization data from the nonvolatile memory.

The nonvolatile memory can utilize the information held by acorresponding one of the register means, as repair information forrepairing defective normal nonvolatile memory cells by replacing themwith redundancy nonvolatile memory cells.

The volatile memory can utilize the information held by thecorresponding one of the register means, as repair information forrepairing the defective normal volatile memory cells by replacing themwith redundancy volatile memory cells.

The volatile memory may be constructed to include dynamic memory cellsas the volatile memory cells and to utilize the information held by theregister means corresponding to the volatile memory, as the controlinformation for specifying the refresh interval of the dynamic memorycells.

The volatile memory may also be constructed to utilize the informationheld by the corresponding one of the register means, as controlinformation for specifying the timing of an internal control signal.

In this third semiconductor integrated circuit device, like before, itis also possible to efficiently change the coupling of a circuit whichhas a large-scale logic construction having a volatile memory packagedtogether with a nonvolatile memory. As a result, the yield of thesemiconductor integrated circuit device having the large-scale logic canbe improved to realize a cost-reduction.

The nonvolatile memory is exemplified by a flash memory, and some ofnonvolatile memory cells are able to store a program to be executed bythe control processing device. The volatile memory is exemplified by aDRAM and can be utilized as a work memory of the control processingdevice. The volatile memory can be exemplified by a fast access memoryin the form of a SRAM.

In a semiconductor integrated circuit device (1A, 1B, 1C) including avolatile memory (12, 13), such as a DRAM or a SRAM, as the memorymodule, the memory module includes a volatile storage circuit (12AR,13AR) for storing repair information on the memory array in a volatilestate. The volatile storage circuit (12AR, 13AR) includes: a pluralityof input terminals or input nodes which can be coupled to the data baseto be formed in the semiconductor integrated circuit device; and acontrol signal input terminal for receiving a control signal (reset) foran operation to set the reading of the repair information, such as anoperation to initialize the semiconductor integrated circuit device. Thememory module includes a plurality of first volatile memory cells, suchas normal volatile memory cells, and a plurality of second volatilememory cells, such as redundancy volatile memory cells, and the volatilestorage circuit (12AR, 13AR) operates to hold repair information forenabling the first volatile memory cells to-be replaced by the secondvolatile memory cells.

The construction is such that the repair information to be set in thevolatile storage circuit (12AR, 13AR) is fed from the outside of thememory module to the volatile storage circuit (12AR, 13AR) in the memorymodule, and the specifications of the circuit or function relating todefect repair of the memory module packaged in the semiconductorintegrated circuit device are standardized or unified. As a result, theusability of the memory module can be improved when it is sold as memorymodule part, i.e., an IP (Intellectual Property) part.

The semiconductor integrated circuit device including a memory module isdesigned by a designing machine composed of a computer (or electroniccomputer), the design data such as the layout data for determining theconstruction of the volatile storage circuit (12AR, 13AR), the circuitfunction data or the connection data are described in such specificcomputer languages as can be understood by the computer. Moreover, thedata is serviced as a storage device, such as the magnetic tape, a MO(Magneto-Optical disk), a CD-ROM or a floppy disk. On the other hand,the design data of the volatile storage circuit (12AR, 13AR) may beserviced while being stored in the data storage device together with thedesign data of the circuit functions of the memory module of thevolatile memory, such as a DRAM or a SRAM. Still moreover, the designdata of the volatile storage circuit (12AR, 13AR) may be stored in thedata storage device while being assembled in the design data of thememory module of the volatile memory, such as a DRAM or a SRAM.

By thus storing and servicing the design data of the memory module andthe semiconductor integrated circuit device containing the former asdesign data, as described in specific computer languages can beunderstood by the computer, in the storage device, it is possible toefficiently design the memory module or the semiconductor integratedcircuit device containing the former.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram showing a first single chip microcomputerrepresenting one example of the semiconductor integrated circuit deviceof the invention,

FIG. 2 is a diagram showing one detailed example of the repairinformation to be used by the single chip microcomputer of FIG. 1;

FIG. 3 is a timing chart showing one example of an initial programmingoperation of the repair information for a reset period;

FIGS. 4(A) and 4(B) are flow charts showing a defect repairable timingfor the single chip microcomputer in time series from a manufacturingstep;

FIG. 5 is a device cross section schematically showing the behavior of alaser-fusing opening of a fuse for a copper wiring process;

FIG. 6 is a circuit diagram showing one example of a dynamic memorycell;

FIG. 7 is a schematic diagram showing one example of a memory cell arrayof a DRAM,

FIG. 8 is a circuit diagram showing one example of a CMOS static memorycell;

FIG. 9 is a schematic diagram showing one example of a memory cell arrayof a SRAM;

FIG. 10 is a circuit diagram showing one example of a flash memory cell;

FIG. 11 is a schematic diagram showing one example of a memory cellarray of a flash memory;

FIG. 12 is a characteristic diagram showing one example of a programmingstate and an erase state in the flash memory;

FIG. 13 is a diagram showing one example of the voltage applied statesin the programming operation and the erase operation of the flashmemory;

FIG. 14 is a block diagram of a second single chip microcomputer anotherembodiment of the semiconductor integrated circuit device according tothe invention;

FIG. 15 is a diagram showing one example of the repair information inthe second single chip microcomputer;

FIG. 16 is a timing chart showing one example of an initial programmingoperation of the repair information in the second single chipmicrocomputer.

FIG. 17 is a block diagram showing a third single chip microcomputerrepresenting still another embodiment of the semiconductor integratedcircuit device according to the invention;

FIG. 18 is a timing chart showing one example of a process for initialprogramming of a reset period with the repair information in the thirdsingle chip microcomputer;

FIG. 19 is a block diagram schematically showing one example of a memoryadopting a construction in which the defect repair is performed byreplacing a memory mat or a memory block;

FIG. 20 is a block diagram showing one example of a single chipmicrocomputer having a voltage step-down circuit;

FIG. 21 is a circuit diagram showing one example of the voltagestep-down circuit;

FIG. 22 is a circuit diagram showing one example of a refresh timer forcontrolling the refresh interval of a memory cell in a data holding modeof a DRAM 12;

FIG. 23 is a timing chart showing one example of the operations of therefresh timer exemplified in FIG. 23;

FIG. 24 is a circuit diagram showing one example of a timing adjustmentcircuit of a sense amplifier activation signal in a timing controller ofa SRAM 13;

FIG. 25 is a diagram showing one example of a format of theinitialization data which are stored in the flash memory when thetechniques individually explained in the defect repair of FIG. 14, thevoltage trimming of FIG. 21, the refresh interval optimization of FIG.22 and the timing adjustment of the timing controller of FIG. 24 areapplied in, connection with one single chip microcomputer exemplified inFIG. 20, and

FIG. 26 is a conceptional diagram showing one example of a system fordesigning a semiconductor integrated circuit device according to theinvention by using a computer.

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Single Chip Microcomputer

FIG. 1 shows a first single chip microcomputer representing oneembodiment of the semiconductor integrated circuit device of theinvention. A single chip microcomputer 1A, as shown in FIG. 1, is formedover one semiconductor substrate made of single crystalline silicon andis positioned as an on-chip system LSI.

The single chip microcomputer 1A is constructed to include a CPU(central processing unit or control processing unit) 10, a flash memory11, which is one example of an electrically erasable and programmablenonvolatile memory, a DRAM 12, which is one example of a volatilememory, a SRAM 13, which is another example of a volatile memory, and aninput/output circuit 14, which are representatively exemplified. Theindividual memories 11, 12 and 13 can be deemed as memory modules. TheCPU 10, flash memory 11, DRAM 12, SRAM 13 and input/output circuit 14share an address bus 15, a data bus 16 of N bits and a control bus 17.

The input/output circuit 14 is connected with an external address bus18A, an external data bus 18D, an external control bus 18C and so on,although the invention is not limited thereto, and the input/outputcircuit 14 is provided with a not-shown input/output port connected withthe buses 18A, 18D and 18C, a bus controller for controlling the startsof the bus cycles for the external buses 18A, 18D and 18C, aninput/output peripheral circuit represented by a serial interfacecircuit, and so on.

The CPU 10 is constructed, although not limitative, to include anexecution unit having an arithmetic logic unit (ALU), a program counter(PC), a stack pointer (SP), a dedicated register such as statusregister, (SR), and a group of general-purpose registers to be used as awork area; and a control unit including an instruction register, towhich there are sequentially inputted program data stored in the flashmemory 11 or program instructions fed from operation system programs,and an instruction decoder for decoding the instructions stored in theinstruction register, to generate control signals for the executionunit. The execution unit is coupled to the address bus 15, the data bus16 and the control bus 17, to control the selective output of an addresssignal to the address bus 15, the selective output of a control signalto the control bus, and the input/output of data through the data bus.Therefore, the CPU 10 controls the operations of the semiconductorintegrated circuit device as a whole in accordance with the program datastored in the flash memory 11 or the operation system programs.

The DRAM 12 is a read/write memory having a relatively large capacity tobe utilized as a work memory or main memory of the CPU 10. The DRAM 12has a capacity as large as several giga bits, for example, according tothe larger scale of the system. A memory cell array 12MA of the DRAM 12has not only normal word lines WLd_0 to WLd_Nd but also a redundancyword line WLdR. The select terminals of normal dynamic memory cells arecoupled to the normal word lines WLd_0 to WLd_Nd, and the selectterminal of redundancy dynamic memory cells is coupled to the redundancyword line WLdR. The constructions of the memory cells need not be madedifferent for the normal and redundancy types. Which one of the normalword lines WLd_0 to WLd_Nd is to be replaced by the selection of theredundancy word line WLdR is determined by the repair information whichis set in a repair address register 12AR. The repair row addressinformation contained in the repair information is compared with a rowaddress signal from an address buffer 12AB by an address comparisoncircuit 12AC. This address comparison circuit 12AC feeds an X decoder12XD with a detect signal 12φ at the logic value “1” when the comparisonresult is coincident. When the detect signal 12φ is at the logic value(logic level) “1”, the X decoder 12XD inhibits the word line selectingoperation by the row address from the address buffer 12AB and selectsthe redundancy word line WLdR. As a result, the memory access relatingto the defective word line is replaced by the selecting operation of theredundancy memory cell relating to the redundancy word line WLdR. Theremaining constructions of the DRAM 12 will be described hereinafter.

The SRAM 13 is utilized as a quick access memory such as a register fileor a data buffer memory. A memory cell array 13MA of the SRAM 13 has notonly normal word lines WLs_0 to WLs_Ns but also a redundancy word lineWLsR. The select terminals of normal static memory cells are coupled tothe normal word lines WLs_0 to WLs_Nd, and the select terminal ofredundancy static memory cells is coupled to the redundancy word lineWLSR. Which are of the normal word lines WLs_0 to WLs_Ns is to bereplaced by the selection of the redundancy word line WLsR is determinedby the repair information which is set in a repair address register13AR. The repair row address information contained in the repairinformation is compared with the row address signal from an addressbuffer 13AB by an address comparison circuit 13AC. This addresscomparison circuit 13AC feeds an X decoder 13XD with a detect signal 13φat the logic value “1” when the comparison result is coincident. Whenthe detect signal 13φ is at the logic value “1”, the X decoder 13XDinhibits the word line selecting operation by the row address from theaddress buffer 13AB, and selects the redundancy word line WLsR. As aresult, the memory access relating to the defective word line isreplaced by the selecting operation of the redundancy memory cellrelating to the redundancy word line WLsR. The remaining constructionsof the SRAM 13 will be described hereinafter.

The flash memory 11 is provided with a memory cell array 11MA in whichelectrically erasable and programmable nonvolatile memory cells havingcontrol gates and floating gates are arranged in the form of a matrix.The memory cell array 11MA is used as regions for storing the operationprograms of the CPU 10 and the repair information of the DRAM 12 and theSRAM 13. The memory cell array 11MA is provided with word lines WLf_0 toWLf_Nf coupled to the control gates of the nonvolatile memory cells andbit lines BLf_0 to BLf_Mf coupled to the drains of the nonvolatilememory cells. It should be understood that the constructions of theseword lines WLf_0 to WLf_Nf and bit lines BLf_0 to BLf_Mf are provided inN sets in the direction normal to the sheet of FIG. 1. In this example,the nonvolatile memory cells for N bits, as arranged at the intersectingpositions of the word line WLf_0 and the bit line BLf_0, provide therepair information storing regions. The timing controls of theoperations to erase, program, verify and read the flash memory 11 aremade by a sequence controller 11SQ. The instructions of these operationsare given by commands from the CPU 10, although the invention is notespecially limited thereto. The flash memory 11 can be erased in theunit of a word line, although the invention is not especially limitedthereto.

The CPU 10 processes a series of data described in the programs, byexecuting the arithmetic operations to fetch and decode the instructionsstored in the flash memory 11 and so on, to acquire operands necessaryfor executing the instructions from the DRAM 12, the SRAM 13 and so onin accordance with the decoding results, to operate the acquiredoperands, and to store the operated results again in the DRAM 12 and theSRAM 13. Whenever a rest signal RESET takes a high level, the CPU 10interrupts all the operations even with an operation being executed, andinitializes a desired node of the internal circuit to a predeterminedlogic value state. In this reset period (while the reset signal RESET isat the high level), the initialization is performed not only on theinside of the CPU 10 but also on the internal register of the not-shownperipheral circuit. This initialization is further performed on therepair address registers 12AR and 13AR to be described hereinafter. Thereset signal RESET is changed to the high level in response to aninstruction of either the power-on reset or the system reset by theoperating power ON. When the reset signal RESET is negated to a lowlevel, the CPU 10 starts the reset exceptional operation. Theinitialization of the CPU 10 for the reset period is performed on theprogram counter, the stack pointer, a control register, such as thestatus register, and so on. In the case of the power ON reset, on theother hand, from the instant when the power is turned ON to the instantwhen the reset is released, the operations of a clock generation circuitare stabilized so that a stable clock signal can be fed to the CPU 10after the release of reset. Here, a clock pulse generator is omittedfrom FIG. 1. As a matter of fact, however, the clock pulse generator isprovided with an oscillator and a frequency divider so that an operationreference clock signal is fed to various infernal circuits, includingthe CPU 10.

In response to the reset period of the reset signal RESET, the flashmemory 11 performs an operation to read the repair information.Specifically, the sequence controller 11SQ, when it detects the resetperiod, activates a sense amplifier 11SA and an output buffer 110B forenabling the reading operations. In response to the reset periodinstructed by the reset signal RESET, on the other hand, an X decoder11XD and a Y decoder 11YD select the word line WLf_0 and the bit lineBLf_0. As a result, the repair information stored in the memory cell ofN bits is outputted to the data bus 16 of N bits.

The repair address registers 12AR and 13AR have static latches of N/2bits for storing the repair information. Although the invention is notespecially limited thereto, the data input terminals of the static latchwhich constitutes the repair address register 12AR are connected, whilethe reset signal RESET is at the high level (logic value) “1”, with theless significant N/2 bits of the data bus 16 of N bits, so that the datainputted for that period can be latched by the inversion of the resetsignal RESET to the low level. The data input terminals of the staticlatch constituting the other repair address register 13AR are connected,while the reset signal RESET is at the high level (or the logic value“1”), with the more significant N/2 bits of the data bus 16 of N bits,so that the data inputted for that period can be latched by theinversion of the reset signal RESET to the low level. When the resetperiod is ended, therefore, the repair information on the lesssignificant side, as read from the flash memory 10 to the data bus 16,is latched by the repair address register 12AR of the DRAM 12, whereasthe repair information on the more significant side is latched by therepair address register 13AR of the SRAM 13. From now on, in the DRAM 12and the SRAM 13, the access at a row address is repaired, if specifiedby the repair information, using the redundancy word lines.

FIG. 2 shows one detailed example of the repair information. In thisexample, as described above, the repair information is a total of N bitsat a maximum. In the repair information of the SRAM 13, referencecharacters AS3 to ASO designate row address information to be repaired,and characters RE_S designate an SRAM repair enable bit indicating thevalidity of the row address information to be repaired. This bit RE_Sindicates the validity of the row address information AS3 to ASO interms of the logic value “1”. The SRAM repair enable bit RE_S programmedin the repair address register 13AR activates, the address comparisoncircuit 13AC, when at the logic value “1”, and keeps the addresscomparison circuit 13AC inactive, when at the logic value “0”, to fixthe detect signal 13φ at the inconsistent level “O”. Likewise, in therepair information of the DRAM 12, reference characters AD3 to ADOdesignate row address information to be repaired, and characters RE_Ddesignate a DRAM repair enable bit indicating the validity of the rowaddress information to be repaired.

This bit RE_D indicates the validity of the row address information AD3to ADO in terms of the logic value “1”. The DRAM repair enable bit RE_Dloaded in the repair address register 12AR activates the addresscomparison circuit 12AC, when at the logic value “1”, and keeps theaddress comparison circuit 12AC inactive, when at the logic value “O”,to fix the detect signal 12φ at the inconsistent level “O”.

FIG. 3 shows timings of the initial programming operations of the repairinformation for the reset period. This reset period is one for which thereset signal RESET is kept at the high level by the power ON reset atthe time of power ON or system reset. When the ON power becomes stable,the word line WLf_0 and a Y selector YSf_0 are selected so that therepair information of the DRAM 12 and the SRAM 13 are read out inparallel to the data bus 16. The read repair information of the DRAM 12is loaded in the repair address register 12AR, and the repairinformation of the SRAM 13 is loaded in the repair address register13AR, so that the load data are latched by the release of reset.

In FIG. 1, the sequence controller 11SQ of the flash memory 11 has amode register 11MR, and the operation of the flash memory 11 isdetermined according to the set content of the mode register 11MR.

Like the well-known flash memory, the mode register 11MR has programenable bits for instructing the programming operations, erase enablebits for instructing the erase operations, and so on. When theprogramming operation and the erase operation are instructed with theprogram enable bits and the erase enable bits, although not shown, theaccessible range in the memory cell array 11MA is determined accordingto the set state of a mode bit MB2. On the other hand, the accesssubject at this time is determined with the value of a mode bit MB1.Specifically, the mode register 11MR can be accessed through the databus 16, and there can be reflected directly on its specific mode bit MB1the value of an external terminal P1 of the single chip microcomputer(as will be called merely the “microcomputer”, too) 1A. The mode bit MB1is for designating an operation mode (or EPROM writer mode) for allowingthe flash memory 11 to be programmed by a write device such as an EPROMwriter connected with the outside of the microcomputer. When the modebit MB1 is given the logic value “1”, the function of the externalinput/output circuit 14 is so changed that the microcomputer 1A may havean external interface function apparently equivalent to thesemiconductor integrated circuit device (or bus slave) of the singleflash memory, and the operations of the CPU 10 are interrupted. Inresponse to the logic value “1”, of the mode bit MB1, more specifically,the buffer circuit connected with the address bus 15, the data bus 16and the control bus 17 of the CPU 10 is set to the high impedance stateso that the CPU 10 is electrically isolated from the individual buses15, 16 and 17. In this EPROM writer mode, the external input/outputcircuit 14 inputs and feeds the address signal from the outside to theaddress bus 15, outputs the data (of the data bus 16 in response to theinstruction of the read operation by the read signal from the outside,and inputs and feeds the data to the data bus 16 in response to a writeoperation instruction by the write signal from the outside. When themode bit MB1 is at the logic value “O”, on the other hand, the flashmemory 11 becomes accessible by the control of the CPU 10. In short, thebuffer circuit coupled to the individual buses 15, 16 and 17 of the CPU10 connects the CPU 10 electrically with the individual buses 15, 16 and17 in response to the logic value “O” of the mode bit MB1.

The mode bit MB2 of the mode register 11MR is a control bit fordetermining whether or not the reprogramming of the nonvolatile memoryfor storing the selective repair information is allowed by the word lineWLf_0 and the Y selector YSf_0, and enables the reprogramming of therepair information in terms of the logic value “O”, but disables thereprogramming of the repair information in terms of the logic value “1”.When the mode bit MB2 is at the logic value “1”, the sequence controller11SQ sets the level of the word line WLf_0 to the voltage such as 0 Vfor disabling both erase and programming irrespective of the row addresssignal in the erase and programming operations. As a result, the eraseoperation at the unit of a word line and the programming operation atthe unit of N bits are disabled together when the memory cell isconnected with the word line WLf_0. When the mode bit MB2 is at thelogic value “O”, the memory cell of the word line WLf_0 can be freelyerased and programmed.

In the microcomputer 1A, which is enabled to set the operation mode, thedefect repairs of the DRAM 12 and the SRAM 13 can be performed (at S2),as exemplified in FIG. 4(A), first of all, on the result of a firstprobe inspection (S1) of a chip which was manufactured in the waferprocess by the maker of the microcomputer 1A. In the repair at thistime, the microcomputer 1A is brought into the EPROM writer mode by themode bit MB1 so that the flash memory 11 can be accessed by using adedicated write device, such as a tester or an EPROM writer, and themode bit MB2 is set to the logic value “O” to write the repairinformation in a predetermined region of the flash memory 11. Afterthis, the probe inspection is performed again (at S3), and a screening(S6) is performed by way of a packaging (S4) and a burn-in test (S5) fortesting the reliability by making the power voltage Vdd higher than thatof the ordinary operation. A chance for repairing a defect can be given(at S7) to the article which was newly found to be defective the burn-intest. When a defect is actualized by the burn-in test in themicrocomputer 1A, which was not found defective at Step S2, for example,it can be repaired (at S7) like before. The defect-repaired article isscreened (at S8) again and is then shipped (at S9). The user havingpurchased that article assembles the microcomputer with a desiredcircuit substrate, so that the assembled circuit is suitably operated(at S10). In this operation, the mode bit MB2 is set to the logic value“1” so that the repair information may not be erroneously reprogrammed.The microcomputer 1A thus operated in the on-board state is caused, ifnecessary, to execute a defect diagnosing test program (or diagnosticprogram) to decide whether or not a defect exists and whether the defectcan be repaired (at S11), if discovered, in the on-board state throughthe CPU 10 which is packaged in the microcomputer 1A. For example,either a defect, which has developed as a microcomputer 1A having nodefect in the manufacturing process is aged to deteriorate its circuitelements or circuit factors, or a new defect, which is developedaccording to changes in the operating environments such as the operatingtemperature or the operating voltage, can be repaired. As compared withthe defect repairing technique using a fuse, as shown in FIG. 4(B), thetime period for the repairs is elongated three or more times.

The diagnostic program for repairing of defects due to the on-boardwrite operation and the write program to be executed at the on-boardprogramming time can be stored in regions other than the word line WLf_0of the flash memory 11. The diagnostic programs could be automaticallyexecuted either by instructing the CPU 10 arbitrarily by an interruptionor by using a timer. Although the content of the diagnostic program isnot shown in detail, it performs the operations to write a predeterminedtest pattern in the SRAM 13 and the DRAM 12 and read it, to determinethe existence of a defect by comparing the read data and expected valuedata, and to inspect, if a defect is detected, whether or not arepairable redundancy construction is left. When the repairableredundancy construction is left, the CPU 10 is caused to execute thewrite program thereby to write the repair information in a predeterminedmemory cell of the flash memory 11 so that the repair information forrepairing the defect may be programmed in the repair information storingnonvolatile memory cell of the flash memory 11. When the repairableredundancy construction is not left, the CPU 10 can set the error statusbit to perform an interruption (e.g., an indication of a service mancall).

The single chip microcomputer 1A thus far described as the system LSIcan eliminate the fuse program circuit for repairing a defect and afusing apparatus or step so that it can lower the testing cost. In viewof the background that the process for forming the laser fusing openingis complicated, as in the copper wiring process, the process ofmanufacture is simplified because no fuse program circuit is used. Letit be assumed, as exemplified in FIG. 5, that the copper wiring layer tobe formed individually through titanium nitride (TiN) layers 105, 111,117 and so on over the lowermost poly-Si wiring layer 102 over a siliconsubstrate (or Si substrate) 100 made of single crystalline silicon forforming the not-shown circuit elements such as MOSFETs thereover are afirst layer 106 to fifth wiring layers (112, 118, 124 and 130). When anopening 133 for exposing the laser-fusible poly-Si fuse through a finalpassivation film 132 is to be formed, the etching gas for etching layerinsulating films (of silicon oxide) 128, 126, 122 and so on and theetching gas for many SiN layers have to be alternately interchanged manytimes causing a significant increase in the number of manufacturingsteps, because it is difficult to remove at a single etching step thesilicon nitride (SiN) layers 131, 127, 125, 121, 119, 115, 113, 109, 107and 103 acting as etching stoppers for forming channels to bury thewiring lines so as to flatten the wiring layers. Unless the fuse programcircuit is used for repairing the defect, no problem arises in theprocess using the copper wiring. In short, the semiconductor integratedcircuit device 1A of the invention and semiconductor integrated circuits1B and 1C to be described hereinafter are given the device structure inwhich the fuse 102C is omitted from the device section of FIG. 5. As aresult, it is possible to provide the semiconductor integrated circuits1A, 1B and 1C which have low wiring resistances and which can operate athigh frequencies.

Since the repair information for the flash memory 11 can bereprogrammed, on the other hand, a defect which has occurred after theburn-in can be newly repaired, and the defect which occurs due to agingafter the assembly in the system or the circuit substrate can also berepaired.

Thus it is possible to improve the efficiency of repairing defect in acircuit, such as a single chip microcomputer 1A having a large-scalelogic construction, on which not only the CPU 10 but also the volatilememory such as the DRAM 12 and the SRAM 13 is mounted together with theflash memory 11. As a result, the yield of the semiconductor integratedcircuit device 1A having a large-scale logic can be improved to realizea cost reduction.

Here will be supplementarily described the constructions, thedescriptions of which have been omitted, of the DRAM 12, SRAM 13 andflash memory 11.

DRAM

In the DRAM 12, the memory cell array 12MA is provided with a number ofwell-known dynamic memory cells DMC including an address selectingMOSFET QS and an information latching capacitor CS, as exemplified inFIG. 6, of which the gate of the MOSFET QS as a selecting terminal isconnected with a corresponding word line WL and the drain or source ofthe MOSFET QS as the data input/output terminal is connected with acorresponding bit line BL. The capacitor CS has one electrode used as acommon electrode PL, which is supplied with a predetermined power sourceequal to one half of the power voltage. The memory cell array 12MA has awell-known folded bit line structure with respect to a sense amplifierSAd of a static latch shape, as exemplified in FIG. 7, and is providedwith bit lines BLd_0 to BLd_Md. In a direction to intersect the bitlines BLd_0 to BLd_Md, there are arranged word lines WLd_0 to WLd_Nd andthe redundancy word line WLdR for repairing a defect. A redundancy bitline also could be provided, although not especially shown. The bitlines BLd_0 to BLd_Md are commonly connected with a common data line12CD through Y selectors YSd_0 to YSd_Md. One of the word lines WLd_0 toWLd_Nd and the redundancy word line WLdR are selected by the X decoder12XD as shown in FIG. 1. One of the Y selectors YSd_0 to YSd_Md isturned ON by the decode output of a Y decoder 12YD. It should beunderstood that the memory cell array 12MA and the Y selectors YSD_0 toYSd md are provided in N sets in the direction normal to the sheet ofFIG. 1. As a result, the data are inputted and outputted in the unit ofN bits to and from the common data line 12CD when the select operationis performed by the X decoder 12XD and the Y decoder 12YD. The programdata are fed from the data bus 16 to an input buffer 12IB so that awrite buffer 12WB drives the bit lines through the common data line 12CDin accordance with the input data. In the data reading operations, theread data transmitted from the bit lines to the common data line 12CDare amplified by the main amplifier 12MA, and the amplified data areoutputted from an output buffer 120B to the data bus 16.

The repair information for specifying the row address of the normal wordline to be repaired by the redundancy word line WLdR is set in therepair address register 12AR. This repair address register 12AR includesa static latch of a plurality of bits, and its data input terminal isconducted to the data bus 16 in response to the high level of the resetsignal RESET so that the repair information is programmed from the databus 16. The repair information thus programmed is compared, when valid,with the row address signal from the address buffer 12AB by the addresscomparison-circuit 12AC. The detect signal 12φ is set to the logic value“1”, when the comparison result is coincident, but otherwise it is setto the logic value “O”. The X decoder 12XD and the Y decoder 12YD arefed with the address signal of the address bus 15 through the addressbuffer 12AB and the decode the address signal fed thereto. Especially,the X decoder 12XD decodes the row address signal from the addressbuffer 12AB, when the detect signal 12φ fed from the address comparisoncircuit 12AC is at the logic value “O” indicating a non-coincidence, butis inhibited from decoding the row address signal from the addressbuffer 12AB and selects the redundancy word line WLdR, when the detectsignal 12φ is at the logic value “1”, indicating a coincidence. As aresult, the memory access relating to the defective word line isreplaced by the select operation of the redundancy memory cell relatingto the redundancy word line WLdR.

The internal timing control of the DRAM 12 is effected by a timingcontroller 12TC. This timing controller 12TC is fed with a strobe signalsuch as the read signal or the write signal from the CPU 10 through thecontrol bus 17 and further with the address signal of a plurality ofbits, deemed as the memory select signal, from the address bus 15. Whenthe operation select of the DRAM 12 is detected by the timing controller12TC, the circuit such as the X decoder 12XD is activated. When the readoperation is instructed by the read signal, the stored information ofthe memory cell selected in the memory cell array 12MA is outputted tothe data bus 16 through the main amplifier 12MA and the output buffer120B. When the write operation is instructed by the write signal, thedata, as inputted through the input buffer 12ID and the write buffer12WB, are written in the memory cell selected in the memory cell array12MA.

SRAM

The SRAM 13 is provided in the memory cell array 13MA with a number ofwell-known CMOS static memory cells SMC, as exemplified in FIG. 8.Specifically, the CMOS static memory cell SMC includes P-channel MOSFETsQP1 and QP2 and N-channel MOSFETs QN1 to QN4, as shown in FIG. 8. TheMOSFETs QP1 and QN1 and the MOSFETs QP2 and QN2 are individually deemedto form CMOS inverters, and their input terminals and output terminalsare cross-connected to construct one CMOS latch circuit as a whole. TheMOSFETs QN3 and QN4 from a select switch. The gates of the MOSFETs QN3and QN4 from the select terminal of the memory cell and are connectedwith the corresponding word line WL. The drains or sources of theMOSFETs QN3 and QN4, as connected with corresponding paired bit lines BLand BBL, are used as the data input/output terminals of the memory cell.The memory cell may be constructed into a resisting program type staticlatch shape. The memory cell array 13MA is provided, as exemplified inFIG. 9, with complementary bit lines BLs_0, BLBs_0 to BLs_Ms, andBLBs_Ms. In a direction to intersect these complementary bit linesBLs_0, BLBs_0 to BLs_Ms, and BLBs_Ms, there are arranged the word linesWLs_0 to WLs_Ns, and there is provided the redundancy word line WLSR forrepairing a defect. The redundancy bit line could also be adoptedalthough not especially shown. The complementary bit lines BLs_0, BLBs_0to BLs_Ms, and BLBs_Ms are commonly connected with a common data line13CD through Y selectors YSs_0, YSBs_0 to YSs_Ms, and YSBs_Ms. As shownin FIG. 1, one of the word lines WLs_0 to WLs_Ns and the redundancy wordline WLSR is selected by the X decoder 13XD. One pair of the Y selectorsYSs_0, YSBs_0 to YSs_Ms, and YSBs_Ms is turned ON with the decode outputof the Y decoder 13YD. It should be understood that the memory cellarray 13MA and the Y selectors YSs_0, YSBS_0 to YSs_Ms and YSBs_Ms areprovided in N sets in a direction normal to the sheet of FIG. 1. As aresult, the data are inputted and outputted in the unit of N bits to andfrom the common data line 13CD when the select operation is performed bythe X decoder 13XD and the Y decoder 13YD. The program data are fed fromthe data bus 16 to an input buffer 13IB so that a write buffer 13WBdrives the bit lines through the common data line 13CD in accordancewith the input data. In the data reading operations, the read datatransmitted from the bit lines to the common data line 13CD areamplified by the sense amplifier 13SA, and the amplified data areoutputted from an output buffer 130B to the data bus 16.

The repair information for specifying the row address of the normal wordline to be repaired by the redundancy word line WLsR is set in therepair address register 13AR. This repair address register 13AR includesa static latch of a plurality of bits, and its data input terminal isconducted to the data bus 16 in response to the high level of the resetsignal RESET so that the repair information is programmed from the databus 16. The repair information thus programmed is compared, when valid,with the row address signal from the address buffer 13AB by the addresscomparison circuit 13AC. The detect signal 13 is set to the logic value“1”, when the comparison result is coincident, but otherwise it is setto the logic value “O”. The X decoder 13XD and the Y decoder 13YD arefed with the address signal of the address bus 15 through the addressbuffer 13AB and they decode the address signal fed thereto. Especially,the X decoder 13XD decodes the row address signal from the addressbuffer 13AB, when the detect signal 130 fed from the address comparisoncircuit 13AC is at the logic value “O” indicating a non-coincidence, butis inhibited from decoding the row address signal from the addressbuffer 13AB and selects the redundancy word line WLSR, when the detectsignal 13φ is at the logic value “1” indicating a coincidence. As aresult, the memory access relating to a defective word line is replacedby the select operation of the redundancy memory cell relating to theredundancy word line WLsR.

The internal timing control of the SRAM 13 is effected by a timingcontroller 13TC. This timing controller 13TC is fed with a strobe signalsuch as the read signal or the write signal from the CPU 10 through thecontrol bus 17 and further with the address signal of a plurality ofbits, deemed as the memory select signal, from the address bus 15. Whenthe operation select of the SRAM 13 is detected by the timing controller13TC, a circuit such as the X decoder 13XD is activated. When the readoperation is instructed by the read signal, the stored information ofthe memory cell selected in the memory cell array 13MA is outputted tothe data bus 16 through the sense amplifier 13SA and the output buffer130B. When the write operation is instructed by the write signal, thedata, as inputted through the input buffer 13IB and the write buffer13WB, are programmed in the memory cell selected in the memory cellarray 13MA.

Flash Memory

The flash memory 11 is provided at its memory cell array 11MA with anumber of nonvolatile memory cells (or flash memory cells) FMC, asexemplified in FIG. 10. The memory cell FMC is constructed to includeone memory cell transistor having a control gate (CG), a floating gate(FG), a source (SC) and a drain (DR). The memory cell array 11MA isprovided, as exemplified in FIG. 11, with bit lines BLf_0 to BLf_Mf, towhich the drains of the flash memory cells FMC are coupled, word linesWLf_0 to WLf_Nf, to which the control gates of the flash memory cellsFMC are coupled, and a source line SLf, to which the sources of theflash memory cells FMC are coupled. In this example, the source line SLfis shared among the individual memory cells FMC. The bit lines BLf_0 toBLf_Mf are commonly connected with a common data line 11CD through the Yselectors YSf_0 to YSf_Mf As shown in FIG. 1, the select operations ofthe word lines WLf_0 to WLf_Nf are performed by, the X decoder 11XD. Thevoltages to be fed to the selected word lines and the non-selected wordlines are controlled by the sequence controller 11SQ in response to theindividual erasing, programming and reading operations. One of the Yselectors YSf_0 to YSf_Mf is turned ON with the decoded output of the Ydecoder 11YD. It should be understood that the memory cell array 11MAand the Y selectors YSf_0, YSf_Mf are provided in N sets in a directionnormal to the sheet of FIG. 1. When the selecting operations areperformed by the X decoder 11XD and the Y decoder 11YD, therefore, thedata can be inputted and outputted in the unit of N bits between thememory cells and the common data line 11CD. The write data are fed fromthe data bus 16 to an input buffer 11IB so that a write buffer 11WBdrives the bit lines through the common data line 11CD in accordancewith the input data. In the data reading operations, the read data, astransmitted from the bit lines to the common data line 11CD, areamplified by the sense amplifier 11SA so that the amplified data areoutputted from the output buffer 110B to the data bus 16. In thisexample, the erase operations are performed in the unit of a word line.Here the source lines, as omitted from FIG. 1, are fed from the sequencecontroller 11SQ with the source line voltages according to the modes ofthe individual erasing, programming and reading operations.

The sequence control and the voltage control of the flash memory 11 areperformed by the sequence controller 11SQ. Here will be described avoltage control mode by the sequence controller 11SQ. First of all, thememory cell FMC (or N channel MOS type memory cell transistor) can holdthe information in dependence upon whether the electric charge is muchor little in the floating gate. When the charge is injected into thefloating gate, for example, the threshold voltage of the memory cellrises. The memory current is stopped by raising the threshold voltage toa voltage value to be applied to the control gate or higher. Bydischarging the electric charge from the floating gate, on the otherhand, the threshold voltage is lowered. When the threshold voltage ismade lower than the value of the voltage to be applied to the controlgate, the memory current flows. As shown in FIG. 12, for example, thestate at the low threshold voltage can be assigned to the “O”information holding state (e.g., the programming state) whereas thestate at the high threshold voltage can be assigned to the “1”information holding state (e.g., the erase state). These assignmentsbelong merely to definitions, and no problem arises even if thedefinitions are reversed. The memory operations are coarsely dividedinto read, program and erase operations. The program verify and theerase verify operations are substantially identical to the readoperation.

In the reading operation, the reading potential (e.g., Vcc=5 V) isapplied to the control gate CG. The stored information of the selectedmemory cell at this time is determined on its “O” or “1”, depending uponwhether or not the electric current flows through that memory cell. Inthe erase operation, as exemplified in FIG. 13, a positive voltage(e.g., 10 V) is applied to the control gate CG, whereas a negativevoltage (e.g., −10 V) is applied to the source of the memory cell. Thedrain DR may be floating or at the same negative voltage (e.g., −10 V)as that of the well. Therefore, the electric charges can be injected bythe tunnel effect into the floating gate. As a result, the thresholdvoltage of the memory cell FMC is raised. The erase verify operation issubstantially identical to the foregoing reading operation, but for thedifference in the word line voltage for the verification. In theprogramming, as exemplified in FIG. 13, a negative potential (e.g., −10V) is applied to the control gate CG, and a positive voltage (e.g., 7 V)is applied to the drain DR to cause the source SC to float. Therefore,the electric charge is released only from the memory cell having apositive voltage applied to its drain. As a result, the thresholdvoltage of the memory cell FMC is lowered. The subsequent writeverifying operation is performed as in the foregoing reading operation.

Second Single Chip Microcomputer

FIG. 14 shows a second single chip microcomputer representing anotherembodiment of the semiconductor integrated circuit device according tothe invention. The single chip microcomputer 1B, as shown in FIG. 14, isdifferent from that of FIG. 1 in that it has a redundancy constructionfor repairing a defect. Specifically, the memory cell array 11MA isprovided with a redundancy word line WLfR in addition to the normal wordlines WLf_0 to WLf_Nf To the redundancy word line WLfR, too, there arecoupled the control gates of the memory cells FMC, of which the drainsare coupled to the corresponding bit lines, whereas the sources arecoupled to the source lines. Which one of the normal word lines WLf_0 toWLf_Nf is to be replaced in selecting the redundancy word line WLfR isdetermined by the repair information which is set in a repair addressregister 11AR. The repair row address information contained in therepair information is compared by an address comparison circuit 11ACwith the row address signal from an address buffer 11AB. The addresscomparison circuit 11AC supplies the X decoder 11XD with a detect signal11φ of the logic value “1” when the comparison result is coincident.When the detect signal 11φ is at the logic value “1”, the X decoder 11YDinhibits the word line selecting operation by the row address from theaddress buffer 11AB, but selects the redundancy word line WLfR. As aresult, the memory access relating to a defective word line is replacedby the operation to select the redundancy memory cell relating to theredundancy word line WLfR.

This construction is not different in the reading of the repairinformation to the data bus 16 for the reset period from theconstruction of FIG. 1 in which the read operation is performed by onetime. In the case of FIG. 14, therefore, the repair information oftotally N bits at the maximum has to be divided by one time into thethree repair address registers 11AR, 12AR and 13AR. In order to satisfythis, it is assumed that the data input terminals of the three repairaddress registers 11AR, 12AR and 13AR are so separately coupled to thesignal lines of individual bits of the data bus of N bits.

FIG. 15 shows one example of the repair information stored in the repairinformation storing region of the flash memory 11. As compared with thatof FIG. 2, there are added repair row addresses AF3 to AFO of the flashmemory 11 and a repair enable bit RE_F of the flash memory. If therepair information to be read out to the data bus 16 is N bits as awhole, the signal line of the data bus 16 is coupled to the data inputterminals of the corresponding repair address registers 11AR, 12AR and13AR keeping the array of FIG. 15. The bit RE_F indicates the validityof the row address information AF3 to AFO with the logic value “1”. Therepair enable bit RE_F, as loaded in the repair address register 11AR,activates the address comparison circuit 11AC, when it is at the logicalvalue “1”, and keeps the address comparison circuit 11AC inactive, whenat the logic value “O”, to fix the detect signal 11φ at the inconsistentlevel “0”.

FIG. 16 shows timings of the initial programming operation of the repairinformation for the reset period. The period for which the reset signalRESET is set at the high level by the power-on reset at the time ofpower ON or by the system reset is the reset period. When the ON poweris stabilized, the word line WLf_0 and the Y selectors YSf_0 areselected so that the items of repair information of the flash memory 11,the DRAM 12 and the SRAM 13 are read out in parallel to the data bus 16.The read repair information of the flash memory 11 is loaded in therepair address register 11AR, the repair information of the DRAM 12 isloaded in the repair address register 12AR, and the repair informationof the SRAM 13 is loaded in the repair address register 13AR, so thatthe load data are latched by releasing the reset.

According to this single chip microcomputer 1B, a defect which occurs inthe flash memory 11 can also be repaired. The remaining points areidentical to those of the single chip microcomputer 1A of FIG. 1, andtheir detailed description will be omitted.

Third Single Chip Microcomputer

FIG. 17 shows a third single chip microcomputer representing stillanother embodiment of the semiconductor integrated circuit deviceaccording to the invention. The single chip microcomputer 1C, as shownin FIG. 17, is different from that of FIG. 1 in that the operation toread the repair information from the flash memory is performed in aplurality of cycles, and in that the data are consecutively latched foreach read cycle of the repair information in a plurality of repairaddress registers. Specifically, the single chip microcomputer 1C isprovided with a clock pulse generator (CPG) 19 and a control circuit 20as the clock control circuit to be initialized in response to a resetinstruction (or reset period) by the reset signal RESET.

The clock pulse generator 19 is provided with an oscillation circuitusing an oscillator and a frequency division circuit or a PLL circuit,for example. When the operating power is turned ON, the reset signalRESET is asserted, and the internal operations are stabilized forgenerating the clock signal. After this, the clock pulse generator 19generates a clock signal CLKR in response to the negation of the resetsignal RESET. As exemplified in FIG. 18, the clock signal CLKR isgenerated three times, although the invention is not especially limitedthereto, and is fed to the control circuit 20. The CPU 10 is initializedwith a reset signal RST which is generated by the clock pulse generator19. The reset period of the CPU 10 continues till the third clock signalCLKR is generated, as exemplified in FIG. 18. When the reset period bythe reset signal RST is ended, the CPU 10 starts the reset exceptionaloperation in synchronism with the clock signal CLK which is generatedfrom the clock pulse generator 19.

For the reset period of the CPU 10 by the reset signal RST, the controlcircuit 20 performs the initial program control of the repairinformation. As exemplified in FIG. 18, more specifically, the controlcircuit 20 asserts a control signal φWO for the periods of the firstcycle and the second cycle of the clock signal CLKR, and asserts acontrol signal φBO in response to the first cycle and a control signalφB1 in response to the second cycle. In response to the asserted periodof the control signal φWO, the sequence controller 11SQ activates thesense amplifier 11SA and the output buffer 110B to control the voltageof the flash memory in a readable manner. In response to the assertedperiod of the control signal φWO, the X decoder 11XD feeds the word lineWLf_0 with the read select level. For the asserted period of the controlsignal φBO, the Y decoder 11YD selects the bit line BLf_0 by the Yselector YSf_0. As a result, for the asserted period of the controlsignal φBO (or the first cycle of the clock signal CLKR), the repairinformation is read out to the data bus 16 from the memory cell of Nbits, as located at the intersection between the word line WLf_0 and thebit line BLf_0. At this time, the control signal φBO is fed to therepair address register 12AR of the DRAM 12, and the data of the databus 16 are inputted for the high level period of the control signal φBOand latched with the low level so that the repair information is latchedin the repair address register 12AR. In the Y decoder 11YD, on the otherhand, the bit line BLf_11 s selected by the Y selector YSf_1 for theasserted period of the next control signal φB1. As a result, for theasserted period of the control signal φBI (or the second cycle of theclock signal CLKR), the repair information is read out to the data bus16 from the memory cell of N bits, as located at the intersectionbetween the word line WLf_1 and the bit line BLf_1. At this time, thecontrol signal φB1 is fed to the repair address register 13AR of theSRAM 13, and the register 13AR inputs the data of the data bus 16 forthe high level period of the control signal φB1 and latches the inputdata with the low level so that the repair information is latched in therepair address register 13AR.

If the repair information of the DRAM 12 is stored in the memory cell atthe intersection between the word line WLf_0 and the bit line BLf_0, andif the repair information of the SRAM 13 is stored in the memory cell atthe intersection between the word line WLf_0 and the bit line BLf_1, therepair information-can be internally transferred consecutively at theunit of N bits to the DRAM 12 and the SRAM 13 in response to the resetinstruction of the single chip microcomputer 1C. The number of theinternal transfers of the repair information to one circuit should notbe limited to one time but can be suitably determined according to theredundancy logic scale proportional to the logic scale of that circuit.For example, the number of control signals to be fed to the Y decodermay be increased so that different Y selectors may be selected for theindividual control signals, and the number of repair address registersof the circuit for receiving the repair information may be increased, ifnecessary. In the case of the construction described with reference toFIG. 1, the period for the initial programming operation of the repairinformation depends on the reset period of the reset signal RESET. Whenthe amount of repair information to be initially programmed is large,the reset period by the reset signal RESET has to be controlledexternally of the microcomputer. In the construction of FIG. 17, afterthe operation of the clock pulse generator 19 has stabilized with thereset signal RESET, the control circuit 20 in the microcomputer 1Ccontrols the initial programming operation of the repair informationautonomously, then no special operation is needed outside of themicrocomputer even for much repair information to be initiallyprogrammed, so that the initial programming of the repair informationcan be ensured. The remaining points are identical to those of thesingle chip microcomputer 1A of FIG. 1, and their detailed descriptionwill be omitted.

In view of the large scale of integration as represented by the on-chipsystem, on the other hand, the stored information of the flash memory 11is utilized for repairing a defect of the SRAM 13 or the DRAM 12 otherthan the flash memory 11 itself, so that the flash memory 11 or onecircuit module packaged on a large-scale integrated circuit device maybe efficiently utilized in relation to another circuit module. Moreover,the construction of the internal transfer of the repair informationthrough the data bus 16 and the serial internal transfer, as dividedinto a plurality of cycles of the repair information, is important inthat the operation to reflect the repair information on each of the SRAM13 and the DRAM 12 in accordance with the increase in that informationcan be realized at a high speed when the repair information increases inproportion to the increase in the number of defects according to thelarge capacity of the SRAM 13, the DRAM 12 and so on.

Block Replacement

The replacement into the redundancy, as has been described hereinbefore,is effected by address comparison, but can be effected by thereplacement of the memory mat or memory block, as exemplified in FIG.19. For example, memory mats MATO to MAT7 are memory blocks, in whichthe normal memory cells are arranged in a matrix. In this example, thereare assigned to each memory block data input/output terminals DO to D7of 1 bit, between which are arranged Y selector circuits YSWO to YSW7and read/write circuits (e.g., sense amplifiers and write amplifiers)RWO to RW7 and so on. There is provided a redundancy memory mat MATR inwhich defect repairing memory cells are arranged in the form of amatrix, and with which are connected a redundancy Y selector circuitYSWR and a read/write circuit RWR. The memory mats MATO to MAT 7 and theredundancy memory mat MATR have mutually identical circuitconstructions. The Y selector circuits YSWO to YSW7 and YSWR selecteither one bit line or one pair of complementary bit lines from thecorresponding memory mats.

In order that one of the memory mats MATO to MAT7 may be replaced by theredundancy memory mat MATR, there are provided selectors SELO to SEL7.These selectors SELO to SEL7 select either the input/output terminals ofthe read/write circuit RWR or the input/output terminals of theread/write circuits RWO to RW7 and connect the selected ones with thedata input/output terminals DO to D7. The select control signals for theselectors SELO to SEL7 are generated by a decoder DL, to which therepair information is fed from a repair information register AR. Theinitial programming method of the repair information is identical tothis one.

According to the example of FIG. 19, the repair information includes arepair enable bit RE and select bits A2 to AO of 3 bits. The decoder DLis constructed to include AND gates ANDO to AND7 constituting decodelogics for the complementary signals of the select bits A2 to AO, andthe outputs of the AND gates ANDO to AND7 are fed to the selectterminals of corresponding selectors SELO to SEL7. Each of the AND gatesANDO to AND7 is fed with the repair enable bit RE and can perform thedecode operation when it is brought into the repair enable state at thelogic value “1”. In other words, with the repair enable bit RE being atthe logic value “O”, all the output select signals of the individual ANDgates ANDO to AND7 are forced to the non-select level.

If the repair is performed by the replacement of the memory mat or thememory block, the address comparing operation is not needed so that theaccess time can be shortened. On the other hand, the bit number of therepair information can be reduced for the repairable scale. This issuitable for the case of a large capacity DRAM. However, the chip areato be occupied by the redundancy is larger than that of the constructionof the address comparison. The construction of FIG. 19 can be applied toany of the SRAM 13, the DRAM 12 and the flash memory 11.

Application to Trimming Circuit

The description thus far has been directed to a case in which the repairinformation for the redundancy is stored for use in the flash memory 11.The trimming information can be stored for use in place of or togetherwith the repair information. Here will be described several examples ofa circuit capable of determining the circuit characteristics by usingtrimming information.

FIG. 20 shows one embodiment of the single chip microcomputer having avoltage step-down circuit. This voltage step-down circuit 31 steps downthe power voltage VDD at 5 v or 3.3 V, as fed from the outside of asingle chip microcomputer 30, to generate an internal power voltage VDL.The internal power voltage VDL thus stepped down is used as theoperating power such as for the CPU 10, the flash memory 11, the DRAM12, the SRAM 13 and so on. The reason for using this step-down voltageVDL is to warrant the reliability of the circuit operations and torealize a low power consumption when the circuit elements areminiaturized for improving the integration and the operating speed. Theinput/output circuit 14 to be interfaced with the outside uses theexternal power voltage VDD as its operating power. Letters VSS designatethe earth side of the circuit. This voltage step-down circuit 31 isprovided with a voltage trimming register 31DR for latching the controlinformation (or voltage trimming information) to determine the referencevoltage for specifying the level of the internal power voltage VDL. Inthe initial programming of this register 31DR with the voltage trimminginformation, as in the foregoing initial programming with the repairinformation, the voltage trimming information is read out from the flashmemory 11 to the data bus 16 in response to the reset instruction sothat the read voltage trimming information is latched in the register31DR.

FIG. 21 shows one example of the voltage step-down circuit 31. Thestep-down voltage is outputted rom a source follower circuit which isconstructed to include an n-channel MOS transistor M5 and a resistanceelement R5. The conductance of the transistor M5 is subjected to anegative feedback control by an operation amplifier AMP2. The voltageVDL is logically equalized to a control voltage VDL1. This controlvoltage VDL1 is outputted from a source follower circuit which isconstructed to include an n-channel MOS transistor M4 and resistanceelements RO to R4. The conductance of the transistor M4 is subjected toa negative feedback control by an operation amplifier AMP1. Thisfeedback line is provided with switch MOS transistors MO to M3 capableof selecting the resistance voltage division ratio by the resistors ROto R4 to construct a trimming circuit. The selection of the switch MOStransistors MO to M3 is performed by a decoder DEC1 for decoding voltagetrimming information TR1 and TRO of 2 bits. The feedback voltage thusgenerated is compared in the operational amplifier AMP1 with a referencevoltage which is generated in a reference voltage generation circuitVGE1. This amplifier AMP1 performs the negative feedback control toequalize the control voltage VDL1 to a reference voltage Vref.

When the element characteristics of the voltage step-down circuit 31 aredispersed relatively largely by the influence of the process, theresistance voltage division ratio to be selected by the decoder DEC1 isso changed that the internal power voltage VDL1 may fall within adesired design range. The information for this can be obtained inadvance from the circuit characteristics which are determined by thedevice test, and may be programmed in advance in the EPROM writer modein a predetermined region (i.e., a predetermined address areacorresponding to the repair information storing region) of the flashmemory 11, as described hereinbefore. When the microcomputer 30 isreset, its voltage trimming information TRO and TR1 are initially loadedin the voltage trimming register 31DR from the flash memory 11.

FIG. 22 shows one example of a refresh timer for controlling the refreshinterval of the memory cells in the data holding mode of the DRAM 12.Letters CM designate a monitoring storage capacitor which is designed tohave a slightly shorter data holding time than that of the storagecapacitor of the dynamic memory cell. An n-channel MOS transistor M15 isa charging transistor for the monitoring storage capacitor CM. Thistransistor M15 is turned ON for a refreshing operation period and OFFfor a data holding period, as exemplified in FIG. 23. For the dataholding period, the level of a voltage at a node VN is lowered by theleakage of the monitoring storage capacitor CM. The degree of this leveldown is detected by a comparator AMP3. This comparator AMP3 outputs ahigh level when the level of the node VN becomes lower than a referencevoltage VR1. This state sets a set/reset type flip-flop FF. As a result,a counter CNT starts its counting operation to generate a refresh clockφREF.

In synchronism with this refresh clock φREF, the refreshing operation isperformed. For example, the refreshing operation at the unit of wordline is performed in synchronism with the clock, cycle of the refreshclock φREF while sequentially incrementing the not-shown refresh addresscounter. By the carry due to the overflow of the counter CNT theflip-flop FF is reset to end the series of refreshing operations. Duringthis refreshing operation, the transistor M15 is kept ON, and themonitoring storage capacitor CM is charged for detecting the subsequentrefresh timing. When the refreshing operation is ended, the transistorM15 is cut off to perform the refresh timing detection again by theleakage.

There is a fear that the charge holding characteristics of themonitoring storage capacitor CM will be fluctuated by the influence ofthe process. In the case of the average charge holding characteristicsof the storage capacitor of the normal memory cells of the DRAM, forexample, data errors or data breakages occur in many memory cells of thecharge holding characteristics. In accordance with the charge holdingperformance of the monitoring storage capacitor CM, therefore, it ispossible to adopt a reference voltage generation circuit 12RF capable ofadjusting the reference voltage VR1.

In this reference voltage generation circuit 12RF, as exemplified inFIG. 22, an output is made by a source follower circuit which isconstructed to include an n-channel MOS transistor M14 and resistanceelements R10 to R14. The conductance of the transistor M14 is subjectedto a feedback control by an operation amplifier AMP4. This feedback lineis provided with switch MOS transistors M10 to M13 capable of selectingthe resistance voltage division ratio by the resistors R10 to R14, toconstruct a trimming circuit. The selection of the switch MOStransistors MIO to M13 is performed by a decoder DEC2 for decodingvoltage trimming information RF1 and RFO of 2 bits. The feedback voltagethus generated is compared in the operational amplifier AMP4 with areference voltage VR which is generated by a reference voltagegeneration circuit VGE2. This amplifier AMP4 performs a negativefeedback control so as to equalize the reference voltage VR1 to thereference voltage VR.

When the charge holding performance of the monitoring storage capacitorCM is fluctuated over the allowable range by the influence of themanufacturing process, the resistance voltage division ratio to beselected by the decoder DEC2 is suitably changed. The information forthis change can be obtained in advance from the charge holdingperformance of the capacitor CM, as determined from the device test, andmay be programmed in advance in the EPROM writer mode in a predeterminedrange (i.e., a predetermined address area corresponding to the storageregion of the repair information) of the flash memory 11, as describedhereinbefore. When the microcomputer 30 is reset, its voltage trimminginformation TRO and TR1 are initially loaded in a refresh timingoptimization register 12DR from the flash memory 11.

FIG. 24 shows a delay circuit for delay of a sense amplifier activationsignal φSA representing one example of the timing adjusting delaycircuit in the timing controller 13TC of the SRAM 13. This timingcontroller 13TC is provided with delay circuits DLO to DL3 of fourserial stages, and CMOS transfer gates TGO to TG3 for selecting theoutputs of the individual delay circuits DLO to DL3. The outputs of theCMOS transfer gates TGO to TG3 are wired OR so that the signal at theircoupling node is fed as a sense amplifier activation signal φSA to thesense amplifier 13SA. Which one of the CMOS transfer gates TGO to TG3 isto be turned ON is determined by a decoder DEC3 for decoding timingadjustment information TMO and TM1 of 2 bits.

When the accessing speed of the SRAM 13 is fluctuated by the influenceof the manufacturing process, it may be not desirable to adjust theactivation timing of the sense amplifier accordingly, than to acquire afast access or to stabilize the data reading operation. It is arbitraryto determine the selected state of the CMOS transfer gates TGO to TG3accordingly. The information for this can be obtained in advance fromthe accessing speed performance which is grasped by the device test, andmay be programmed in advance in the EPROM writer mode in a predeterminedregion (i.e., a predetermined address area corresponding to the repairinformation storing region) of the flash memory 11, as describedhereinbefore. When the microcomputer 30 is reset, its items of timingadjustment information TMO and TMI are initially loaded in the timingadjustment register 13DR from the flash memory 11 through the data bus16 by the same procedure as that of the repair information.

The techniques, as individually described in connection with the defectrepair of FIG. 14, the voltage trimming of FIG. 21, the optimization ofthe refresh inverter of FIG. 22, and the timing adjustment of the timingcontroller of FIG. 24, can be applied altogether to the semiconductorintegrated circuit device such as the one single chip microcomputer 30,as exemplified in FIG. 20. At this time, the information to be stored inthe flash memory 11 can be positioned as initialization data fordetermining the partial function of the circuit, and is stored with theformat of FIG. 25, for example, in the memory cell array 11MA of theflash memory 11.

FIG. 26 shows one example of a system for designing a semiconductorintegrated circuit device by using a computer.

In FIG. 26, reference numeral 100 designates a computer (or anelectronic computer) such as a personal computer, and numeral 101designates a keyboard for inputting data in the electronic computer. Onthe other hand, numeral 102 designates a recording medium, such as afloppy disk.

This recording medium is recorded in advance with data necessary fordesigning the semiconductor integrated circuit device. In order todesign the semiconductor integrated circuit device shown in FIG. 1, forexample, the recording medium 102 stores data 103 for determining theconstruction of the flash memory (11); data 104 for determining theconstruction of the DRAM (12); data 105 for determining the constructionof the repair address register (12AR); and data 106 for determining theconstruction of the data bus (16).

A semiconductor integrated circuit device can be designed on theelectronic computer by reading out the data necessary for an objectiveto be designed, to the electronic computer from the recording medium.

The individual data may be exemplified by the programs (e.g., the RTL(Register Transfer Level) model or the HDL (Hardware DescriptionLanguage) model) which are programmed in such specific computerlanguages as can be understood by the electronic computer, or the data(e.g., coordinate data or connecting/wiring data) on the mask to beactually used for manufacturing the semiconductor integrated circuitdevice. Of course, the combination of these two may be used as the data.

In the description thus far made, the data for determining theconstruction of the repair address register is the data 105. However, itis quite natural that the construction of the register (e.g., thevoltage trimming register shown in FIG. 20, the refresh timingoptimization register shown in FIG. 22, the timing adjustment registershown in FIG. 24, or their composite register shown in FIG. 25) to beused for changing the electric characteristics may be determined by thedata 105.

On the other hand, in the description concerning FIG. 1, the repairaddress register (12AR) and the address comparison circuit (12AC) areprovided in the DRAM (12). These may be exemplified by the data 105other than the data 104 for determining the construction of the DRAM(e.g., the memory array 12MA, the decoders 12XD and 12YD, the Yselector, the write buffer, the input buffer, the main amplifier or theoutput buffer). Of course, the DRAM (12) shown in FIG. 1 may be handledas one data group.

Although the invention made by us has been specifically described inconnection with various embodiments, it should not be limited to theembodiments but could naturally be modified in various manners withoutdeparting from the gist thereof.

For example, the semiconductor integrated circuit device according tothe invention should not be limited to a single chip microcomputer, andthe kind of packaged circuit module of the single chip microcomputershould not be limited to the examples but can be suitably modified. Onthe other hand, the electrically reprogrammable nonvolatile memoryshould not be limited to a flash memory, but may adopt memory cellswhich include select MOS transistors and MNOS (Metal Nitride OxideSemiconductor) storage transistors. On the other hand, the voltageapplied states for programming and erasing the flash memory should notbe limited to the ones described, but could be suitably modified. On theother hand, the nonvolatile memory may store information of multiplevalues such as four or more values. On the other hand, the volatilememory should not be limited to the SRAM or the DRAM but may beexemplified by a ferroelectric memory.

In a memory such as a DRAM, SRAM or flash memory, the redundancy wordline is selected according to the address comparison result obtained bythe address comparison circuit so that its select timing is liable to bedelayed more than that of the normal word line. The timing delay of thiskind cannot be neglected especially when the semiconductor integratedcircuit device operates in a seriously quick operation cycle. For thiscase, if a slight increase in the area is allowed, the size of theinformation storing capacitor in the redundancy dynamic memory cell canbe made larger than that of the normal memory cell, or the transistor inthe redundancy static memory cell or the flash memory cell can beenlarged in size to augment its conductance. In this case, morespecifically, the amount of the read signal to be fed from the selectedredundancy memory cell to the bit line can be augmented so that thenormal data read can be effected even if the read sense operation timingis accordingly accelerated. As a result, the influence due to the delayin the select timing of the redundancy word line can be substantiallylightened by the speed-up of the sense operation after the memory cellwas selected.

The adjusting technique for adjusting the refresh period of the DRAM, ashas been described with reference to FIG. 22, can be modified. When thedata holding time characteristics of several dynamic memory cells areshifted relatively largely with respect to the charge voltage holdingcharacteristics of the capacitor CM of FIG. 22, the reference voltageVR1 of FIG. 22 can be so positively modified that the refreshingoperations may be repeated for the normal operation period of thosedynamic memory cells. The trimming for warranting the refreshingoperation of the DRAM can be adopted, and, in place of the constructionof FIG. 22, a construction in which the counted number of a counter ortimer for counting the clock signals, such as the system clock signalsof the semiconductor integrated circuit device, to generate the refreshtiming signal is changed. On the other hand, the invention is highlyeffective when applied to an on-chip system LSI, but could naturally beapplied to a logic LSI other than a system LSI. In FIGS. 1, 14 or 15,moreover each memory module 11, 12 or 13 has been described to includeone redundancy word line, but the number may be plural. With thisplurality, it is possible not only to improve the repairing efficiencybut also to repair a defect which is detected at each of the defectrepairing steps S2, S7 and S10, as shown in FIG. 14(A).

The effects to be obtained by the representative features of theinvention disclosed herein will be briefly described in the following.

Specifically, the fuse program circuit for a coupling change such as adefect repair can be eliminated, and an apparatus or step for a fusingtreatment can be omitted, so that the testing cost can be lowered. Sincea laser-fusing opening need not be formed even for a process such as acopper wiring process, moreover, the process of manufacture issimplified Since the coupling control information for the nonvolatilememory can be reprogrammed, it is possible to sufficiently satisfy ademand for a coupling change against either a defect which occurs at alater step such as the burn-in step in the manufacturing process or adefect which occurs after the packaging over the system or the circuitsubstrate.

This makes it possible to efficiently change the coupling between thecontrol processing unit such as the central processing unit and acircuit having a large-scale logic construction on which a volatilememory is mounted together with a nonvolatile memory. As a result, theyield of the semiconductor integrated circuit device having alarge-scale logic can be improved to realize a cost reduction.

Especially, in view of the large scale of the system on-chip, in orderto utilize the nonvolatile memory mounted on the large-scale integratedcircuit efficiently in relation to another circuit module, the storedinformation of the nonvolatile memory is utilized for changing thecoupling of the volatile memory, other than the nonvolatile memory.However, the means for the transfer of the coupling control informationthrough the data bus and the series transfer of the plurality of cyclesof the coupling control information is excellent in that, when thepossibility of a coupling change increases according to the largercapacity of the volatile memory, the process to reflect the controlinformation on the individual volatile memories in accordance with theincrease in the amount of control information can be realized at a highspeed.

What is claimed is:
 1. A semiconductor integrated circuit device on asingle semiconductor substrate, the semiconductor integrated circuitdevice comprising; a voltage step-down circuit coupled to receive afirst and a second external power supply voltage and to generate aninternal power supply voltage, the voltage step-down circuit including avolatile storage circuit to store information to trim a voltage level ofthe internal power supply voltage; an internal circuit coupled toreceive the internal power supply voltage and the second external powersupply voltage so that the internal circuit operates between theinternal power supply voltage and the second external power supplyvoltage; and nonvolatile memory elements to store the information,wherein the information stored in the nonvolatile memory elements isread out and outputted from the nonvolatile memory elements in responseto an initialization of the semiconductor integrated circuit device, andwherein the volatile storage circuit latches the information suppliedfrom the nonvolatile memory elements in response to the initializationof the semiconductor integrated circuit device so that the internalpower supply voltage which is trimmed by the information is suppliedfrom the voltage step-down circuit to the internal circuit.
 2. Asemiconductor integrated circuit device according to claim 1, furthercomprising; an input and output circuit coupled between the first andthe second external power supply voltage to input data from external ofthe semiconductor integrated circuit device; and a data bus coupled tothe input and output circuit, to the nonvolatile memory elements, to thevolatile storage circuit in the voltage step-down circuit and to theinternal circuit, wherein the information is supplied to the volatilestorage circuit via the data bus from the nonvolatile memory elements.3. A semiconductor integrated circuit device according to claim 1,wherein the voltage step-down circuit includes: a reference voltagegeneration circuit to generate a reference voltage; an amplifier havinga first input coupled to receive the reference voltage, a second inputand an output; an MOSFET having a gate coupled to the output of theamplifier, a source coupled to receive the first external power supplyvoltage and a drain; resistance elements coupled between the source ofthe MOSFET and the second external power supply voltage; and switchingMOS transistors each having a source-drain path coupled between thesecond input of the amplifier and the corresponding common connectionpoint of the resistance elements, wherein one of the switching MOStransistors is turned on according to the information stored in volatilestorage circuit.
 4. A semiconductor integrated circuit device accordingto claim 1, wherein the nonvolatile memory elements each includes afloating gate where electrons are to be charged.
 5. A semiconductorintegrated circuit device according to claim 1, wherein the internalcircuit includes one or more circuits selected from a central processingunit, a static random access memory, and a dynamic random access memory.6. A semiconductor integrated circuit device on a single semiconductorsubstrate, the semiconductor integrated circuit device comprising: avoltage step-down circuit coupled to receive a first and a secondexternal power supply voltage and to generate an internal power supplyvoltage, the voltage step-down circuit including a volatile storagecircuit to store information to trim a voltage level of the internalpower supply voltage; an internal circuit coupled to receive theinternal power supply voltage and the second external power supplyvoltage so that the internal circuit operates between the internal powersupply voltage and the second external power supply voltage; and anonvolatile memory which includes nonvolatile memory cells to store theinformation, wherein the information stored in the nonvolatile memorycells is read out and outputted from the nonvolatile memory cells inresponse to an initialization of the semiconductor integrated circuitdevice, and wherein the volatile storage circuit latches the informationsupplied from the nonvolatile memory cells in response to theinitialization of the semiconductor integrated circuit device so thatthe internal power supply voltage which is trimmed by the information issupplied from the voltage step-down circuit to the internal circuit. 7.A semiconductor integrated circuit device according to claim 6, furthercomprising: an input and output circuit coupled between the first andthe second external power supply voltage and to input data from externalof the semiconductor integrated circuit device; and a data bus coupledto the input and output circuit, to the nonvolatile memory calls, to thevolatile storage circuit, the voltage step-down circuit and to theinternal circuit, wherein the information is supplied to the volatilestorage circuit via the data bus from the nonvolatile memory calls.
 8. Asemiconductor integrated circuit device according to claim 6, whereinthe voltage step-down circuit includes; a reference voltage generationcircuit to generate reference voltage; an amplifier having a first inputcoupled to receive the reference voltage, a second input and an output;an MOSFET having a gate coupled to the output of the amplifier, a sourcecoupled to receive the first external power supply voltage and a drain;resistance elements coupled between the source of the MOSFET and thesecond external power supply voltage; and switching MOS transistors eachhaving a source-drain path coupled between the second input of theamplifier and a corresponding common connection point of the resistanceelements, wherein one of the switching MOS transistors is turned onaccording to the information stored in volatile storage circuit.
 9. Asemiconductor integrated circuit device according to claim 6, whereinthe nonvolatile memory elements each includes a floating gate whereelectrons are to be charged.
 10. A semiconductor integrated circuitdevice according to claim 6, wherein the internal circuit includes oneor more circuits selected from a central processing unit, a staticrandom access memory, and a dynamic random access memory.